Company Filing History:
Years Active: 2006
Title: Innovations of Soon Goo Lee in Semiconductor Technology
Introduction
Soon Goo Lee is a notable inventor based in Kyonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package and method for fabricating the same.
Latest Patents
Soon Goo Lee holds 1 patent for his invention titled "Semiconductor package and method for fabricating the same." This patent describes a semiconductor package that includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The design features a resin layer with an opening at its center, allowing for the stacking of semiconductor chips. The encapsulant serves to protect the chips from external environmental factors, showcasing Lee's innovative approach to semiconductor packaging.
Career Highlights
Soon Goo Lee is currently employed at Amkor Technology, Inc., a leading company in the semiconductor industry. His work at Amkor has allowed him to further develop his expertise in semiconductor packaging and fabrication methods. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Some of Soon Goo Lee's coworkers include Won Sun Shin and Do Sung Chun. Their collaborative efforts in the field of semiconductor technology have contributed to the success of their projects and innovations.
Conclusion
Soon Goo Lee's work in semiconductor technology exemplifies the spirit of innovation and creativity. His patent for a semiconductor package demonstrates his commitment to advancing the field. His contributions continue to impact the industry positively.