Company Filing History:
Years Active: 2007
Title: Innovations by Inventor Soo San Yong
Introduction
Soo San Yong, a notable inventor from Selangor, Malaysia, has made significant contributions to the field of semiconductor technology. With a keen focus on innovation, he has developed a patented method that enhances the efficiency of wire bonding processes in electronic devices.
Latest Patents
Soo San Yong holds one patent titled "Wirebonding Insulated Wire and Capillary Therefor". This invention presents an improved technique for bonding an insulated wire to facilitate enhanced electrical connectivity. The method involves the use of a capillary to manipulate the bond wire over a bond pad, effectively tearing the insulation and ensuring that the metal core of the wire makes direct contact with the bond pad. This innovative approach is further refined by roughening the capillary tip, which aids in the insulation tearing process. Ultimately, his method employs thermocompression bonding to secure the wire to the pad, significantly improving the reliability of electrical connections in semiconductor applications.
Career Highlights
Soo San Yong is currently employed at Freescale Semiconductor, Inc., a recognized leader in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable. With a patent to his name, he stands out as an innovator in a competitive field.
Collaborations
Throughout his career, Soo San Yong has collaborated with talented coworkers such as Fuaida Harun and Chiaw Mong Chan. These professional relationships have likely contributed to his success and the advancements made in semiconductor bonding technologies. Collaboration within such a specialized field fosters innovation, making it essential for continued growth and development.
Conclusion
Soo San Yong's contributions to wire bonding technology demonstrate the importance of innovation in the semiconductor industry. With his patent focusing on improving performance through a novel technique, he has positioned himself as a key player in the advancement of electronic connectivity solutions. His work not only showcases the potential of individual inventors but also highlights the critical role of collaboration within research institutions and companies like Freescale Semiconductor, Inc.