The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Aug. 29, 2003
Fuaida Harun, Selangor, MY;
Chiaw Mong Chan, Selangor, MY;
Lan Chu Tan, Selangor, MY;
Lau Teck Beng, Kuala Lumpur, MY;
Kong Bee Tiu, Selangor, MY;
Soo San Yong, Selangor, MY;
Fuaida Harun, Selangor, MY;
Chiaw Mong Chan, Selangor, MY;
Lan Chu Tan, Selangor, MY;
Lau Teck Beng, Kuala Lumpur, MY;
Kong Bee Tiu, Selangor, MY;
Soo San Yong, Selangor, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An improved method of bonding an insulated wire () that has one end connected to a first bond pad () to a second bond pad () includes moving a tip of a capillary () holding the bond wire () over the surface of the second bond pad () such that the bond wire () is rubbed between the capillary tip () and the second bond pad (), which tears the bond wire insulation so that at least a portion of a metal core of the wire () contacts the second bond pad (). The wire () is then bonded to the second pad () using thermocompression bonding. The tip of the capillary () is roughened to enhance the tearing of the bond wire insulation.