Selangor, Malaysia

Chiaw Mong Chan


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations by Chiaw Mong Chan: A Pioneer in Wirebonding Technology

Introduction: Chiaw Mong Chan, based in Selangor, Malaysia, is an inventive force known for his contributions to wirebonding technology. With a singular patent to his name, Chan has demonstrated an ability to enhance the efficiency of bonding insulated wires, a crucial element in the semiconductor industry.

Latest Patents: Chiaw Mong Chan's patent, titled "Wirebonding Insulated Wire and Capillary Therefor," presents a novel method for bonding insulated wires. The innovation entails moving a capillary tip, which holds the bond wire, over the surface of a second bond pad. This process rubs the bond wire between the capillary tip and the bond pad, effectively tearing the insulation and allowing the metal core of the wire to make contact with the pad. The bond is subsequently secured using thermocompression bonding. Additionally, the roughened tip of the capillary is designed to enhance the insulation tearing process, marking a significant advancement in semiconductor manufacturing.

Career Highlights: Chiaw Mong Chan is currently associated with Freescale Semiconductor, Inc., where he optimizes and develops methods that refine wirebonding processes. His experience and expertise have not only made an impact on the company but have also contributed significantly to the industry as a whole.

Collaborations: Throughout his career, Chan has collaborated with notable colleagues including Fuaida Harun and the skilled engineer Lan Chu Tan. Their teamwork exemplifies the innovative spirit within Freescale Semiconductor, Inc., and enhances the collaborative culture that fosters technological advancement.

Conclusion: Chiaw Mong Chan stands out as an innovative inventor within the semiconductor field, showcasing how a single patent can lead to pivotal improvements in technology. His work in wirebonding methods not only reflects his inventiveness but also highlights the importance of collaboration among talented individuals in driving progress within the industry.

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