Soo-hyun Ha

Title: The Innovative Contributions of Soo-hyun Ha

Introduction

Soo-hyun Ha is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work has been instrumental in advancing the capabilities of semiconductor packages, which are crucial components in modern electronic devices.

Latest Patents

Among his latest patents, Soo-hyun Ha has developed innovative semiconductor packages. One of his notable inventions includes a semiconductor package that features a first semiconductor chip with a through-electrode, a second semiconductor chip connected to the top surface of the first chip, and a first connection bump that includes a first pillar structure and a first solder layer. Additionally, there is a second connection bump located between the two semiconductor chips, designed to electrically connect them, which also includes a second pillar structure and a second solder layer. This design enhances the efficiency and performance of semiconductor packages.

Career Highlights

Soo-hyun Ha is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the development of advanced semiconductor solutions. His expertise in this field has positioned him as a key player in the industry.

Collaborations

Throughout his career, Soo-hyun Ha has collaborated with talented individuals such as Sun-kyoung Seo and Cha-Jea Jo. These collaborations have fostered innovation and have led to the successful development of various semiconductor technologies.

Conclusion

Soo-hyun Ha's contributions to semiconductor technology are noteworthy and reflect his dedication to innovation. His patents and work at Samsung Electronics Co., Ltd. continue to influence the industry and pave the way for future advancements in electronics.