Zhongli, Taiwan

Songyuan Chang

This inventor holds 1 USPTO granted patent. Top assignee: Uwiz Technology Co., Ltd.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Songyuan Chang. Retrieved from https://idiyas.com/inventor/songyuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Songyuan Chang

Introduction

Songyuan Chang is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of chemical mechanical planarization, particularly in the polishing of metal surfaces. His innovative approach has led to the development of a unique composition that enhances the efficiency of the polishing process.

Latest Patents

Songyuan Chang holds a patent for a composition useful in the chemical mechanical planarization of metal. This polishing composition includes polishing abrasive, an oxidizing agent, an accelerating compound, an inhibitor, a co-inhibitor, and a solvent. The invention is designed to maintain a high removal rate during polishing while inhibiting static etch rates and reducing defects such as metal dishing and erosion. This composition simplifies the processing and minimizes waste, particularly during the polishing of bulk copper layers.

Career Highlights

Chang is currently associated with Uwiz Technology Co., Ltd., where he applies his expertise in developing advanced polishing compositions. His work has been instrumental in improving the efficiency and effectiveness of metal polishing processes in various applications.

Collaborations

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Conclusion

Songyuan Chang's innovative contributions to chemical mechanical planarization demonstrate his commitment to advancing technology in the field. His patented composition not only enhances polishing efficiency but also addresses common challenges in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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