Solomon Fridman

Title: Solomon Fridman: Innovator in Circuit Assembly Technology

Introduction

Solomon Fridman is a notable inventor based in Farmington, CT (US). He has made significant contributions to the field of circuit assembly technology, holding 2 patents that showcase his innovative approach to electrical engineering.

Latest Patents

Fridman's latest patents include a hinged circuit assembly with a multi-conductor framework. This invention involves a circuit assembly created by overmolding an electrically insulating material around a unitary framework of electrically conductive material. The framework forms coplanar conductors that are interconnected by an integral structural member. The overmolded material secures the conductors in place and allows for portions of the structural member to be severed, which electrically isolates the conductors from one another. Additionally, the overmolded material positions electrical components with leads that connect to the conductors. The ends of the conductors are shaped into terminals that extend out of a hinge formed in the overmolded material, enabling the terminals to be oriented in a different plane than the conductors.

Career Highlights

Throughout his career, Solomon Fridman has worked with prominent companies such as U.S. Philips Corporation and Philips Electronics North America Corporation. His experience in these organizations has contributed to his expertise in circuit assembly technology and innovation.

Collaborations

Fridman has collaborated with notable coworkers, including David C. Casali and John E. Opie. These collaborations have likely enriched his work and contributed to the development of his patented technologies.

Conclusion

Solomon Fridman is a distinguished inventor whose work in circuit assembly technology has led to valuable patents. His innovative designs and collaborations with industry professionals highlight his significant contributions to the field.