This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Shindengen Electric Manufacturing. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Soichiro Umeda: Semiconductor Device Packaging Innovation
Introduction
Soichiro Umeda is an inventor associated with Saitama, Japan, and Shindengen Electric Manufacturing. His recorded patent concerns the packaging and electrical connections of a semiconductor device.
Latest Patents
Umeda is associated with 1 patent, titled “Semiconductor Device Package with Flat Plate and Pin Terminals.” The invention describes a semiconductor device built on an insulating substrate, with conductor portions supporting and connecting the semiconductor element. It also features terminals linked to the device’s electrodes, a connection member joining the control electrode to a conductor portion, and a supported pin terminal connected to that conductor portion. Sealing resin encloses key components of the assembly.
Career Highlights
Umeda’s listed work at Shindengen Electric Manufacturing is connected to semiconductor device packaging. The patent’s design addresses how components are arranged, electrically connected, supported, and sealed within a package.
Collaborations
Atsushi Kyutoku is identified as Umeda’s coworker. The available information does not specify whether Kyutoku collaborated on this patent.
Conclusion
Soichiro Umeda’s recorded patent presents a semiconductor package design that integrates conductor portions, pin terminals, structural support, and resin sealing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile