Suwon-si, South Korea

Sohyeon Park

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sohyeon Park. Retrieved from https://idiyas.com/inventor/sohyeon-park-2drxcd5j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Sohyeon Park’s Camera-Module Patent

Introduction

Sohyeon Park is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics Ltd. His listed patent work concerns an electronic device with a camera module and a window-bracket assembly. He is credited with 1 patent.

Latest Patents

“Electronic Device Including Camera Module” describes an electronic device with a housing and an optical module positioned inside it. A window bracket supports a window and includes an opening aligned with the optical module, a raised boss around the opening, and a stepped portion along the boss’s edge. An adhesive member attaches the window to the bracket at the step surface. A recess in the stepped portion is configured so that the distance from the step surface to a specified point exceeds the adhesive member’s thickness.

Career Highlights

Park’s listed patent reflects work on the structural design of camera-module components, particularly the bracket and adhesive arrangement used to attach a window within an electronic device. The available information associates this work with Samsung Electronics Ltd.

Collaborations

The provided information lists Jongjoo Je and Sanghun Park as Park’s coworkers. It does not specify their roles or contributions to the patent.

Conclusion

Sohyeon Park’s listed invention focuses on a window-bracket structure designed for an electronic device’s camera module, with a recessed stepped portion forming part of its adhesive arrangement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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