Singapore, Singapore

Sock Hoon Lim

This inventor holds 2 USPTO granted patents. Top assignee: Applied Materials, Inc.. Active years: 2026.


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Innovations by Sock Hoon Lim

Introduction

Sock Hoon Lim is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing wafer processing and metrology systems, which are crucial for the semiconductor manufacturing industry.

Latest Patents

Sock Hoon Lim's latest patents include an "In-situ integrated wafer parameter detection system with remote plasma cleaning" and "Methods and apparatus for verifying alignment between a shadow ring and a substrate." The first patent describes a system that comprises at least one non-active chamber with a feedthrough access port designed to interact with a metrology apparatus. This system allows for continuous and real-time monitoring of wafer processing results. The second patent provides methods and apparatus for verifying the alignment between an opaque shadow ring and a substrate, utilizing a transparent ring with gauge marks and pins for precise measurements.

Career Highlights

Sock Hoon Lim is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has positioned him as a key player in advancing technologies that improve wafer processing efficiency and accuracy.

Collaborations

Throughout his career, Sock Hoon Lim has collaborated with talented individuals such as Ramie Madeja and Wee Teng Fan. These collaborations have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Sock Hoon Lim's contributions to semiconductor technology through his patents and work at Applied Materials, Inc. highlight his role as an influential inventor in the industry. His innovations continue to shape the future of wafer processing and metrology systems.

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