Cheonan-si, South Korea

So Yeon Lim

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Hyundai Mobis Corporation, Sonid Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: So Yeon Lim. Retrieved from https://idiyas.com/inventor/so-yeon-lim-iu5bmsgf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: So Yeon Lim: Inventor of a Photocurable Adhesive for Three-Dimensional Electrical Components.

Introduction

So Yeon Lim is an inventor based in Cheonan-si, South Korea. Her patent work includes a photocurable pressure-sensitive adhesive composition designed for electrical components with three-dimensional structures.

Latest Patents

Lim is associated with 1 patent: “Photocurable Pressure-Sensitive Adhesive Composition for Electrical Components with Three-Dimensional Structure.” The invention describes a functional adhesive composition intended to provide heat resistance and bending resistance. Its specified ingredients include a urethane acrylate oligomer, an acrylate monomer, a photoinitiator, a silane coupling agent, a light stabilizer, an ultraviolet absorber, and an antioxidant. The patent also addresses an electrical component with a three-dimensional structure that uses the composition.

Career Highlights

Lim’s listed company affiliations include Hyundai Mobis Corporation and Sonid Inc. Her patent focuses on adhesive materials for electrical components, combining photocuring with properties intended to support heat resistance and bending performance.

Collaborations

Her listed coworkers include Hyeon Don Kim and Jae Min Lee.

Conclusion

So Yeon Lim’s patent work centers on a photocurable adhesive composition for three-dimensional electrical components, with an emphasis on heat resistance and bending resistance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…