This inventor holds 1 USPTO granted patent. Top assignee: Qorvo US, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Smreeti Dahariya: Innovator in Multichip Module Thermal Management
Introduction
Smreeti Dahariya is a notable inventor based in Chapel Hill, NC (US). He has made significant contributions to the field of thermal management in multichip modules. His innovative approach focuses on enhancing the efficiency and reliability of integrated circuits.
Latest Patents
Dahariya holds a patent for "Multichip module thermal management through backside metal." This invention involves systems and methods that utilize a metal heat conductor or spreader attached to the backside of flip chip integrated circuits (ICs). The design improves the thermal path for heat removal, thereby reducing the risk of damage to the ICs and preventing delamination of the module. The patent outlines various methods for constructing these backside metal systems and includes features that enhance structural integrity.
Career Highlights
Smreeti Dahariya is currently employed at Qorvo US, Inc., where he applies his expertise in thermal management technologies. His work has been instrumental in advancing the performance of multichip modules, making them more efficient and reliable.
Collaborations
Dahariya collaborates with talented professionals in his field, including Md Hasnine and Mark C Woods. These partnerships contribute to the innovative solutions developed at Qorvo US, Inc.
Conclusion
Smreeti Dahariya's contributions to multichip module thermal management demonstrate his commitment to innovation and excellence in engineering. His patent reflects a significant advancement in the field, ensuring better performance and reliability for integrated circuits.