Hong Kong, China

Siu San Chiu


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:

goldMedal1 out of 833,002 
Other
 patents

Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Siu San Chiu: Innovator in Piezoelectric Sensor Technology

Introduction: Siu San Chiu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of ultrasonic bonding technology. His innovative work focuses on the development of sensors that enhance the efficiency and effectiveness of bonding processes.

Latest Patents: Siu San Chiu holds a patent for a "Piezoelectric sensor for measuring bonding parameters." This sensor is designed for use in ultrasonic bonding apparatuses. It features a piezoelectric material positioned between the ultrasonic transducer and an ultrasonic concentrator. The sensor is equipped with at least two outputs that measure different bonding parameters. These outputs are specifically chosen to optimize the signal response for the bonding parameters being assessed. Siu San Chiu's patent is a testament to his ingenuity and technical expertise, with 1 patent to his name.

Career Highlights: Throughout his career, Siu San Chiu has demonstrated a commitment to advancing technology in his field. His work has not only contributed to the development of new tools but has also paved the way for improved bonding techniques in various applications. His innovative spirit and dedication to research have made him a respected figure in the industry.

Collaborations: Siu San Chiu has worked alongside talented individuals such as Lai Wa Chan-Wong and Siu Wing Or. These collaborations have fostered an environment of creativity and innovation, leading to advancements in their respective fields.

Conclusion: Siu San Chiu's contributions to piezoelectric sensor technology highlight his role as a leading inventor in Hong Kong. His patent for measuring bonding parameters showcases his ability to innovate and improve existing technologies. His work continues to influence the field of ultrasonic bonding, making a lasting impact on the industry.

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