The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Feb. 23, 2000
Applicant:
Inventors:
Lai Wa Chan-Wong, Kowloon, HK;
Siu San Chiu, Kowloon, HK;
Siu Wing Or, Kowloon, HK;
Yiu Ming Cheung, Kowloon, HK;
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 ; B23Q 1/500 ;
U.S. Cl.
CPC ...
B23K 1/06 ; B23Q 1/500 ;
Abstract
A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.