Hong Kong, China

Siu Hong Choy


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Siu Hong Choy: Innovator in Bonding Tool Alignment

Introduction

Siu Hong Choy is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology. His innovative approach has led to the development of a unique apparatus and method for aligning bonding tools.

Latest Patents

Siu Hong Choy holds 1 patent for his invention titled "Apparatus and method for alignment of a bonding tool." This invention provides an apparatus and method for aligning a bonding tool. A force sensor with multiple sensing sections measures the force generated by the bonding tool. Each sensing section detects the amount of force from a part of the bonding tool, allowing for precise alignment determination.

Career Highlights

Siu Hong Choy is currently employed at Asm Assembly Automation Limited. His work at this company focuses on advancing technologies related to assembly automation. His expertise in bonding tools has positioned him as a valuable asset in his field.

Collaborations

Siu Hong Choy has collaborated with notable coworkers, including Lai Wa Helen Chan and Chou Kee Peter Liu. Their combined efforts contribute to the innovative projects at Asm Assembly Automation Limited.

Conclusion

Siu Hong Choy's contributions to bonding tool technology exemplify his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in the precision of bonding tool alignment.

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