Siqi Zhang

Title: Siqi Zhang: Innovator in Wafer Processing Technology

Introduction

Siqi Zhang is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of wafer processing technology. Her innovative approach has led to the development of a unique method that enhances the efficiency of die attachment processes.

Latest Patents

Siqi Zhang holds a patent for a method titled "Package process, DAF replacement." This method involves dicing a wafer and applying a mask. It includes spraying die bond material at a first temperature to the surface of the wafer and cooling the die bond material at a second temperature to partially solidify it. The process also entails removing the mask from the wafer through the die bond material. After the mask removal, the die bond material is cured to form a die attach film layer on the wafer.

Career Highlights

Siqi Zhang is currently employed at Western Digital Technologies, Inc. Her work focuses on advancing technologies that improve the manufacturing processes of semiconductor devices. She has demonstrated a strong commitment to innovation and excellence in her field.

Collaborations

Siqi collaborates with talented professionals, including her coworkers Xu Wang and Pradeep Rai. Together, they work on various projects that aim to push the boundaries of technology in the semiconductor industry.

Conclusion

Siqi Zhang is a remarkable inventor whose contributions to wafer processing technology are noteworthy. Her innovative methods and dedication to her work continue to influence the industry positively.