The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jul. 21, 2020
Western Digital Technologies, Inc., San Jose, CA (US);
Siqi Zhang, Shanghai, CN;
Xu Wang, Shanghai, CN;
Pradeep Rai, San Jose, CA (US);
Shrikar Bhagath, San Jose, CA (US);
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
A method is disclosed herein. The method includes dicing a wafer and applying a mask. The method includes spraying die bond material, at a first temperature, to a surface of the wafer and cooling the die bond material at a second temperature to at least partially solidify the die bond material. The method also includes removing the mask from the wafer through the die bond material. After the removing of the mask, the method includes curing the die bond material to form a die attach film layer on the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile