Mentor, OH, United States of America

Singa D Tobing

This inventor holds 1 USPTO granted patent. Top assignee: Avery Dennison Corporation. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Singa D Tobing. Retrieved from https://idiyas.com/inventor/singa-d-tobing-xrsjpsfl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Singa D Tobing: Innovator in Adhesive Technology

Introduction

Singa D Tobing is a notable inventor based in Mentor, OH (US). He has made significant contributions to the field of adhesive technology, holding a patent that showcases his innovative approach to creating adhesives.

Latest Patents

Singa D Tobing holds a patent for "Adhesives and method for making same." This patent reflects his expertise and dedication to advancing adhesive formulations and manufacturing processes. He has successfully developed a solution that addresses specific needs in the industry.

Career Highlights

Singa is currently employed at Avery Dennison Corporation, a leading company in the adhesive and labeling industry. His work at Avery Dennison has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Singa has collaborated with talented individuals such as Andrew Klein and Thomas Edward White. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Singa D Tobing is a dedicated inventor whose work in adhesive technology has made a lasting impact. His patent and contributions at Avery Dennison Corporation highlight his commitment to innovation in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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