Atlanta, GA, United States of America

Sing Yi Chau

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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4 patents (USPTO):Explore Patents

Title: Sing Yi Chau: Innovator in Hot Melt Adhesive Technologies

Introduction

Sing Yi Chau is a prominent inventor based in Atlanta, GA, known for his contributions to the field of adhesive technologies. He holds a total of 4 patents, showcasing his innovative approach to solving complex problems in adhesive dispensing systems.

Latest Patents

Chau's latest patents include groundbreaking inventions such as "Hot melt systems, feeder devices and methods for moving particulate hot melt adhesive." This patent describes a feeder device designed to transport particulate hot melt adhesive from an adhesive supply to an adhesive melter. The device features a body with an inlet and outlet, along with a mechanical agitator that ensures efficient flow of the adhesive.

Another significant patent is the "Adhesive dispensing device having optimized cyclonic separator unit." This invention incorporates a heater unit for melting adhesive material and a cyclonic separator unit that effectively delivers adhesive pellets to the receiving space. The design minimizes splashing of molten adhesive while preventing adhesive build-up, enhancing the overall efficiency of the dispensing process.

Career Highlights

Sing Yi Chau is currently employed at Nordson Corporation, where he continues to develop innovative solutions in adhesive technology. His work has significantly impacted the industry, leading to advancements in adhesive application methods.

Collaborations

Chau collaborates with talented individuals such as Justin A Clark and William M Ridge, contributing to a dynamic team focused on innovation and excellence in adhesive technologies.

Conclusion

Sing Yi Chau's inventive spirit and dedication to improving adhesive systems have established him as a key figure in the industry. His patents reflect a commitment to innovation that continues to shape the future of adhesive technologies.

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