Orange, CA, United States of America

Simon McElrea

This inventor holds 2 USPTO granted patents. Top assignees: Alliedsignal Inc., Honeywell International Inc.. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Simon McElrea. Retrieved from https://idiyas.com/inventor/simon-mcelrea-ls36twa6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: The Innovations of Simon McElrea

Introduction

Simon McElrea is an accomplished inventor based in Orange, CA. He has made significant contributions to the field of high-density interconnect (HDI) production. With a total of 2 patents, his work focuses on improving the yield and efficiency of multi-layer interconnects.

Latest Patents

McElrea's latest patents include a method of making a multi-layer interconnect. This method involves processes where panels are tested to identify good cells or parts. Good cells are then removed from the panels, and new panels are created entirely of identified or known good cells. This innovative approach allows for an increase in the number of layers used in HDI without the typical decrease in yield associated with such layering processes.

Career Highlights

Throughout his career, Simon McElrea has worked with notable companies such as Honeywell International Inc. and AlliedSignal Inc. His experience in these organizations has contributed to his expertise in the field of interconnect technology.

Collaborations

Some of his coworkers include Richard J Pommer and Brad Banister. Their collaboration has likely played a role in advancing the projects they have worked on together.

Conclusion

Simon McElrea's innovative patents and career achievements highlight his significant impact on the field of high-density interconnect production. His work continues to influence advancements in technology and manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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