Hong Kong, China

Simon Leung

This inventor holds 1 USPTO granted patent. Top assignee: Safe-T Products, Inc.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Simon Leung. Retrieved from https://idiyas.com/inventor/simon-leung-g1gqul2v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Simon Leung: Innovator in Stamp Pad Technology

Introduction

Simon Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of stamp pad technology. With a focus on practical solutions, Leung has developed innovative products that enhance user experience.

Latest Patents

Leung holds a patent for a "Case for Multiple Stamp Pads." This invention features a unique design that includes a first housing portion for retaining a first stamp pad and a second housing portion for a second stamp pad. The case is equipped with a hinge that allows movement between a closed configuration, where the stamp pads are sealed, and an open configuration, where they are exposed for use. Additionally, a divider separates the stamp pads in the closed configuration and swingably covers one of the pads in the open configuration.

Career Highlights

Simon Leung is currently employed at Safe-T Products, Inc., where he continues to innovate and develop new products. His work has been instrumental in advancing the functionality and convenience of stamp pad cases.

Collaborations

Leung collaborates with J Bruce Stoneberg, a coworker who shares his passion for innovation and product development.

Conclusion

Simon Leung's contributions to stamp pad technology exemplify his commitment to innovation and practicality. His patent for a case that accommodates multiple stamp pads showcases his ability to address user needs effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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