San Francisco, CA, United States of America

Simon J Trivett

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Apple Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Simon J Trivett. Retrieved from https://idiyas.com/inventor/simon-j-trivett-d4a5qhtd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Simon J. Trivett

Introduction: Simon J. Trivett is a talented inventor based in San Francisco, CA, known for his contributions to the field of integrated circuit technology. His innovative patent focuses on structural and thermal management solutions that enhance the performance and reliability of integrated circuits. With his work at a leading technology company, he has made significant strides in promoting efficient thermal energy dissipation.

Latest Patents: Simon holds a patent for "Structural and thermal management of an integrated circuit." This patent addresses modifications and enhancements for assemblies used with integrated circuits. The application showcases the use of multiple thermal components, including vapor chambers, fin stacks, and heat pipes, providing a dual-sided thermal energy extraction solution. Additionally, it emphasizes the importance of maintaining contact between an integrated circuit and the circuit board, using compression forces from multiple plates.

Career Highlights: Simon J. Trivett works at Apple Inc., where he leverages his expertise to drive advancements in technology. His career is marked by a commitment to innovation and excellence within the field of electronics. The development of his patented technology reflects his dedication to improving thermal management solutions for integrated circuits, which is crucial for enhancing device performance.

Collaborations: Throughout his career, Simon has collaborated with notable colleagues, including Brett W. Degner and Mahesh S. Hardikar. These partnerships contribute to a dynamic working environment at Apple Inc., facilitating the exchange of ideas and expertise that fosters innovation in technology.

Conclusion: Simon J. Trivett exemplifies the spirit of innovation in the technology sector through his inventive solutions for integrated circuits. His patent addressing structural and thermal management underscores the importance of optimizing thermal performance in electronic devices. As part of Apple Inc., Simon continues to play a vital role in pioneering advancements that shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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