COLOGNE, Italy

Silvano Bosio


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Silvano Bosio: Innovator in Lid Application Technology

Introduction

Silvano Bosio is a notable inventor based in Cologne, Italy. He has made significant contributions to the field of packaging technology, particularly in the design of apparatuses for applying lids to products. His innovative approach has led to the development of a unique patent that enhances the efficiency of lid application processes.

Latest Patents

Silvano Bosio holds a patent for an "Apparatus for applying a lid to a support containing a product." This apparatus comprises a supporting element with a contact portion and a closing element with a fixing portion. These elements are designed to move between a home position and a working position, allowing for the effective clamping of a lid to a product's lateral wall. The design ensures that the fixing portion securely holds both the lid and the lateral wall, streamlining the packaging process.

Career Highlights

Bosio's career is marked by his work at G. Mondini S.p.A., a company known for its innovative packaging solutions. His role has allowed him to apply his expertise in engineering and design to create practical solutions for the packaging industry. His contributions have not only advanced the technology but have also improved operational efficiencies within the company.

Collaborations

Throughout his career, Silvano has collaborated with notable colleagues such as Paolo Mondini and Daniel Paderni. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas, leading to the development of cutting-edge packaging technologies.

Conclusion

Silvano Bosio's work exemplifies the spirit of innovation in the packaging industry. His patent for the apparatus for applying lids demonstrates his commitment to improving product packaging processes. His contributions continue to influence the field and inspire future advancements in packaging technology.

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