South Barrington, IL, United States of America

Sikendar Fidai


 

 

Average Co-Inventor Count = 8.6

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2000-2013

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3 patents (USPTO):Explore Patents

Title: Sikendar Fidai: Innovator in Radio Frequency Subsystem Interfaces

Introduction

Sikendar Fidai is a notable inventor based in South Barrington, IL (US). He has made significant contributions to the field of radio frequency subsystem interfaces, holding a total of 3 patents. His work focuses on enhancing communication systems through innovative methods and devices.

Latest Patents

Fidai's latest patents include a "Method and device for establishing an inter-radio frequency subsystem interface (ISSI) group call." This invention involves a hosted inter-radio frequency subsystem interface (HIF) that maintains a list of affiliated radio frequency subsystems (RFSSs). The HIF facilitates group calls by transmitting requests between the home RFSS and the serving RFSS. Another significant patent is the "Method and device for establishing an inter-radio frequency subsystem interface (ISSI) unit-to-unit call." This invention enables calls between units of different home RFSSs through the HIF, streamlining communication processes.

Career Highlights

Throughout his career, Sikendar Fidai has worked with prominent companies such as Motorola Solutions, Inc. and Motorola Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of radio frequency technology.

Collaborations

Fidai has collaborated with notable coworkers, including Trent J. Miller and Rod N. Averbuch. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Sikendar Fidai is a distinguished inventor whose work in radio frequency subsystem interfaces has led to valuable patents and advancements in communication technology. His contributions continue to influence the industry and pave the way for future innovations.

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