Hsinchu, Taiwan

Sih-Wei Chang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Inventor Sih-Wei Chang

Introduction

Sih-Wei Chang is an accomplished inventor based in Hsinchu, Taiwan. He is recognized for his significant contributions to the field of heat dissipation technology. With a focus on optimizing thermal management solutions, he has successfully developed innovative devices that leverage unique materials and methods.

Latest Patents

Sih-Wei Chang holds a patent for a composite heat dissipation device and its preparation method and applications. This inventive device consists of an electromagnetic radiation dissipation pile that incorporates a polar dielectric material assembly. This assembly includes several polar dielectric material units, designed to interact effectively with solar radiation. The surfaces of these units generate light scattering, while the optical phonons within each unit enhance the strength of thermal radiation. This innovation is poised to impact various applications where efficient thermal management is critical.

Career Highlights

Currently, Sih-Wei Chang is affiliated with Tsinghua University, where he actively engages in research and development. His work emphasizes the integration of advanced materials in heat dissipation technologies, pushing the boundaries of conventional methods in thermal management.

Collaborations

Throughout his career, Sih-Wei Chang has collaborated with notable colleagues, including Yen-Jen Chen and De-hui Wan. These partnerships have fostered a collaborative environment conducive to innovation, leading to significant advancements in their respective fields.

Conclusion

Sih-Wei Chang's contributions to the realm of heat dissipation technology highlight the importance of innovative approaches in addressing thermal management challenges. With one patent to his name and ongoing research at Tsinghua University, he continues to pave the way for future advancements in this critical area of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…