The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
May. 18, 2022
Applicant:
National Tsing Hua University, Hsinchu, TW;
Inventors:
Ching-Wen Hwang, Hsinchu, TW;
Sih-Wei Chang, Hsinchu, TW;
Yen-Jen Chen, Hsinchu, TW;
De-Hui Wan, Hsinchu, TW;
Hsuen-Li Chen, Hsinchu, TW;
Assignee:
NATIONAL TSING HUA UNIVERSITY, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); B29C 67/04 (2017.01); D01D 5/00 (2006.01); D04H 1/728 (2012.01); F28F 21/08 (2006.01); H05K 5/00 (2025.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20427 (2013.01); B29C 67/04 (2013.01); D01D 5/003 (2013.01); D04H 1/728 (2013.01); F28F 21/089 (2013.01); H05K 7/20336 (2013.01);
Abstract
A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.