Copenhagen, Denmark

Signe Friis Schack

This inventor holds 3 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignee: 3Shape A/s. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Signe Friis Schack. Retrieved from https://idiyas.com/inventor/signe-friis-schack

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

 

Average Co-Inventor Count = 3.8

ph-index = 1


Company Filing History:


Years Active: 2022-2026

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3 patents (USPTO):Explore Patents

Title: Signe Friis Schack: Innovator in 3D Technology

Introduction

Signe Friis Schack is a notable inventor based in Copenhagen, Denmark. She is currently associated with 3Shape A/S, a company renowned for its innovative solutions in 3D technology. Despite having no patents to her name, her contributions to the field are significant.

Latest Patents

As of now, Signe Friis Schack holds 3 patents. This indicates that her work may be more focused on collaborative projects or research rather than individual patent filings.

Career Highlights

Signe has made a mark in the industry through her role at 3Shape A/S. Her expertise in 3D technology has been instrumental in advancing the company's product offerings. She has worked alongside talented colleagues, including Astrid Anna Toftegaard and Mikael Nielsen, contributing to a dynamic work environment.

Collaborations

Due to space constraints, the details of Signe's collaborations will not be covered in this article.

Conclusion

Signe Friis Schack is an influential figure in the realm of 3D technology, contributing her skills and knowledge to 3Shape A/S. Her journey reflects the importance of collaboration and innovation in driving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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