Singapore, Singapore

Siew Ling Chong

This inventor holds 1 USPTO granted patent. Top assignees: Agency for Science, Technology and Research, The Procter Gamble Company. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Siew Ling Chong. Retrieved from https://idiyas.com/inventor/siew-ling-chong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Siew Ling Chong: Innovator in Adhesive Technology

Introduction

Siew Ling Chong is a notable inventor based in Singapore, recognized for his contributions to adhesive technology. He holds a patent that showcases his innovative approach to enhancing bonding strength in various applications.

Latest Patents

Siew Ling Chong's most recent patent is titled "Adhesive having increased bonding strength." This invention focuses on articles that utilize a thermal imprinted adhesive on a substrate of a plurality of certain conicals, resulting in improved bonding strength. His work in this area demonstrates a significant advancement in adhesive applications.

Career Highlights

Throughout his career, Siew Ling Chong has worked with esteemed organizations, including the Agency for Science, Technology and Research and The Procter & Gamble Company. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking innovations in adhesive technology.

Collaborations

Siew Ling Chong has collaborated with talented individuals such as Fung Ling Yap and Chang Sheng Lee. These partnerships have fostered a creative environment that has led to the development of impactful inventions.

Conclusion

Siew Ling Chong's work in adhesive technology exemplifies the spirit of innovation. His patent and collaborations highlight his commitment to advancing the field, making him a significant figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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