Company Filing History:
Years Active: 2021
Title: Siew Ching Seah: Innovator in Semiconductor Technology
Introduction
Siew Ching Seah is a notable inventor based in Melaka, Malaysia. She has made significant contributions to the field of semiconductor technology, particularly through her innovative patent.
Latest Patents
Siew Ching Seah holds a patent titled "Porous Cu on Cu surface for semiconductor packages." This invention involves a semiconductor package that includes a plurality of metal leads and a semiconductor die attached to these leads by an interconnect. The surfaces of the metal leads, the metallized surface of the semiconductor die, and/or the surface of the interconnect comprise copper (Cu) with a thermal conductivity ranging from 340 to 400 W/mK and an electrical conductivity between 80 to 110% IACS. Additionally, these surfaces include micropores with diameters ranging from 1 µm to 10 µm. The patent also describes a method for manufacturing a metal surface with such micropores.
Career Highlights
Siew Ching Seah is currently employed at Infineon Technologies AG, where she continues to advance her research and development in semiconductor technologies. Her work has been instrumental in enhancing the performance and efficiency of semiconductor packages.
Collaborations
Siew Ching Seah collaborates with esteemed colleagues, including Norbert Pielmeier and Chin Yung Lai, who contribute to her innovative projects and research endeavors.
Conclusion
Siew Ching Seah's contributions to semiconductor technology through her patent demonstrate her expertise and commitment to innovation in the field. Her work continues to influence advancements in semiconductor packaging, showcasing the importance of research and development in technology.