This inventor holds 2 USPTO granted patents. Top assignee: Gestamp Umformtechnik Gmbh. Active years: 2017-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2019
Title: Siegfried Loesch: Innovator in Hot Forming Technology
Introduction
Siegfried Loesch is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of hot forming technology, particularly in the manufacturing of sheet steel components. With a total of 2 patents to his name, Loesch continues to push the boundaries of innovation in his industry.
Latest Patents
Loesch's latest patents focus on a forming tool and method for hot forming and partially press hardening a workpiece made of sheet steel. The first patent describes a forming tool that includes a die, a punch, and a cooling device. This tool is designed to enhance the efficiency of the forming process by incorporating movable die and punch parts that interact with an opening device. This innovation allows for a shorter closing time, improving the overall productivity of the manufacturing process. The second patent elaborates on a method for hot forming, where the workpiece is heated prior to forming. This method also utilizes a forming tool with similar components, ensuring that the contact between the workpiece and the tool is optimized for better results.
Career Highlights
Siegfried Loesch is currently associated with Gestamp Umformtechnik GmbH, a company renowned for its expertise in metal forming technology. His work at Gestamp has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of manufacturing techniques in the automotive industry.
Conclusion
Siegfried Loesch stands out as a key figure in the realm of hot forming technology. His patents reflect a commitment to innovation and efficiency in manufacturing processes. As he continues to develop new methods and tools, his contributions will undoubtedly shape the future of the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile