This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Siang Kuan Chua: Innovator in Semiconductor Technology
Introduction
Siang Kuan Chua is a notable inventor based in Johor, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances semiconductor packaging.
Latest Patents
Siang Kuan Chua holds a patent for "Clips for semiconductor packages." This invention discloses a clip designed for semiconductor packages, which includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar is coupled to the first planar portion, and each first solder ball is connected to a corresponding first pillar. This design aims to improve the efficiency and reliability of semiconductor packaging.
Career Highlights
Siang Kuan Chua is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at the company allows him to apply his expertise in developing advanced technologies that meet the demands of the industry.
Collaborations
Some of his coworkers include Mohd Kahar Bajuri and Abdul Rahman Mohamed. Their collaboration contributes to a dynamic work environment that fosters innovation and creativity in semiconductor technology.
Conclusion
Siang Kuan Chua's contributions to semiconductor technology through his patent and work at Infineon Technologies AG highlight his role as an influential inventor in the field. His innovative spirit continues to drive advancements in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile