Infineon Technologies Ag

Siang Kuan Chua

Ke Yan Tean

Abdul Rahman Mohamed

Mohd Kahar Bajuri

A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.

Growing community of inventors

Johor, Malaysia

Siang Kuan Chua