Singapore, Singapore

Siang Aun Yeoh

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Siang Aun Yeoh. Retrieved from https://idiyas.com/inventor/siang-aun-yeoh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Siang Aun Yeoh and His Patent for Cooling Electronic Components

Introduction

Siang Aun Yeoh is an inventor associated with Singapore and Hewlett-Packard Development Company, L.P. His patent work addresses the cooling of electronic components, focusing on how airflow can be managed around an array of fans.

Latest Patents

Yeoh is credited with 1 patent: “System and Method for Orienting a Baffle Proximate an Array of Fans That Cool Electronic Components.” The invention describes a baffle positioned near an array of fans and designed to assume different orientations relative to the fans. This adjustability can help direct airflow used to cool electronic components.

Career Highlights

Yeoh’s listed patent reflects work on practical thermal-management technology for electronic systems. The patent is associated with Hewlett-Packard Development Company, L.P., connecting his invention to the company’s development of computing and electronic products.

Collaborations

Yeoh’s listed coworkers include Mun Hoong Tai and Su Nee Chin. Their shared association provides context for the collaborative environment surrounding his patent work.

Conclusion

Siang Aun Yeoh’s patent highlights an adjustable baffle design for managing fan airflow and cooling electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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