Eagan, MN, United States of America

Shwi-Long J Hwang

This inventor holds 1 USPTO granted patent. Top assignee: 3M Innovative Properties Company. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shwi-Long J Hwang. Retrieved from https://idiyas.com/inventor/shwi-long-j-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Shwi-Long J Hwang: Innovator in Pressure Sensitive Adhesives

Introduction

Shwi-Long J Hwang is a notable inventor based in Eagan, MN (US). He has made significant contributions to the field of adhesive technology, particularly through his innovative patent.

Latest Patents

Hwang holds a patent for a "Pressure sensitive adhesive composition, articles made therewith and method of use." This invention describes a pressure sensitive adhesive composition that comprises the reaction product of a copolymer and a bisamide crosslinking agent. The copolymer includes a (meth)acrylate ester of a non-tertiary alcohol with an alkyl group containing between 1 and 4 carbon atoms, along with a carboxylic acid-functional, ethylenically unsaturated co-monomer. The bisamide crosslinking agent is defined by a specific chemical formula.

Career Highlights

Hwang is associated with 3M Innovative Properties Company, a leader in adhesive technologies. His work has contributed to advancements in the development of pressure sensitive adhesives, which are widely used in various applications.

Collaborations

Some of Hwang's notable coworkers include Kurt C Melancon and Timothy D Filiatrault, who have collaborated with him on various projects within the adhesive technology sector.

Conclusion

Shwi-Long J Hwang's innovative work in pressure sensitive adhesives exemplifies the importance of research and development in creating effective adhesive solutions. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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