Guangzhou, China

Shutian Su

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Guangzhou Heygears Imc. Inc. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shutian Su. Retrieved from https://idiyas.com/inventor/shutian-su-eihinlqx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Shutian Su and Automated 3D Printing

Introduction

Shutian Su is an inventor based in Guangzhou, China, associated with Guangzhou Heygears Imc. Inc. His work includes an invention designed to automate the removal and collection of printed objects in 3D printing.

Latest Patents

Su is credited with 1 patent, titled “Object Shoveling Mechanism, 3D Printer and 3D Printing Method.” The invention concerns a mechanism for removing a printed object from a 3D printer’s forming platform and transferring it to a receiving position. It uses a shoveling tool, driven relative to the platform, to separate the object from the forming surface. A carrying element and its drive assembly then move into position to receive the object.

The disclosed approach is intended to let a printer operate unattended, reduce labor costs, and improve printing efficiency.

Career Highlights

Su’s listed patent reflects work in 3D-printing technology, particularly the automation of post-printing handling. The invention combines object removal and collection in a mechanism designed for use with a 3D printer.

Collaborations

Su is associated with Guangzhou Heygears Imc. Inc. His listed coworkers include Junhua Liu and Jiajing Zhou.

Conclusion

Shutian Su’s patent addresses a practical challenge in 3D printing by automating the removal and collection of printed objects, with the aim of supporting more efficient, unattended operation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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