Tokyo, Japan

Shunsuke Furuya

This inventor holds 3 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignees: Dai Nippon Printing Co., Ltd., Dai Nippon Printing. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shunsuke Furuya. Retrieved from https://idiyas.com/inventor/shunsuke-furuya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.6

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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3 patents (USPTO):Explore Patents

Title: Shunsuke Furuya - Innovator in Packaging Technology

Introduction

Shunsuke Furuya is an inventor based in Tokyo, Japan. He is currently employed at Dai Nippon Printing Co., Ltd. Although he has not yet been granted any patents, he is actively involved in innovative packaging technologies. His work focuses on developing advanced materials and structures for packaging applications.

Latest Patent Applications

Shunsuke Furuya has submitted several patent applications that showcase his expertise in packaging technology. One of his latest applications is for a barrier laminate, lid material, and packaging container. This application describes a barrier laminate that includes a substrate and a sealant layer, where the substrate is a barrier substrate made of a polypropylene resin layer and an evaporated film. The application highlights the thermal shrinkage ratios of the laminate after heat treatment, demonstrating its effectiveness in packaging solutions.

Another application involves a pouch, lidded container, and tube. This application details a first packaging material that includes layers located in both a first and second region. It also describes a communication part connected to a hole in the pouch, emphasizing the design's functionality and efficiency in packaging.

Conclusion

Shunsuke Furuya is a promising inventor in the field of packaging technology, with a focus on innovative materials and designs. His latest patent applications reflect his commitment to advancing packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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