Nagano, Japan

Shun Horiuchi

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Mimaki Engineering Company, Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shun Horiuchi. Retrieved from https://idiyas.com/inventor/shun-horiuchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Shun Horiuchi: Innovator in 3-D Inkjet Printing Technology

Introduction

Shun Horiuchi is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of inkjet printing technology. His innovative approach focuses on addressing challenges related to layer warpage in 3-D printing.

Latest Patents

Horiuchi holds a patent for a 3-D inkjet printing method with layer warpage control and an ink set. This method involves printing forward and reverse warp inks in a specific arrangement to minimize warping. The forward warp ink is designed to cure and shrink differently on the side exposed to light, while the reverse warp ink compensates for this effect on the opposite side. This innovative approach enhances the quality and precision of 3-D printed objects.

Career Highlights

Horiuchi is currently employed at Mimaki Engineering Company, Ltd., where he continues to develop cutting-edge printing technologies. His work has positioned him as a key figure in the advancement of 3-D printing methods.

Collaborations

Horiuchi collaborates with Akira Takatsu, contributing to the development of innovative printing solutions. Their partnership has fostered advancements in the field, enhancing the capabilities of inkjet printing technology.

Conclusion

Shun Horiuchi's contributions to 3-D inkjet printing technology demonstrate his commitment to innovation and excellence. His patent for a method that controls layer warpage is a testament to his expertise and creativity in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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