Company Filing History:
Years Active: 2015
Title: Shumpei Tanaka: Innovator in Semiconductor Technology
Introduction
Shumpei Tanaka is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative spirit and technical expertise.
Latest Patents
Tanaka's latest patents include a dicing die bond film and a method of manufacturing semiconductor devices. The dicing die bond film is designed to prevent yielding and breaking of the dicing film, ensuring that it can be suitably broken with a tensile force. Key features of this invention include a tensile strength of the contact part at 25°C being between 15 N and 80 N, and a yield point elongation of 80% or more. Additionally, the laminated sheet he developed aims to maintain adhering strength and electrical reliability, allowing for the peeling of a back grinding tape from multiple semiconductor elements after dicing.
Career Highlights
Shumpei Tanaka is currently employed at Nitto Denko Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.
Collaborations
Tanaka collaborates with talented coworkers, including Takeshi Matsumura and Hiroyuki Senzai, who contribute to the innovative environment at Nitto Denko Corporation.
Conclusion
Shumpei Tanaka's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.