Company Filing History:
Years Active: 2019-2022
Title: Innovations of Shuji Sagara
Introduction
Shuji Sagara is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wiring substrates and semiconductor devices. With a total of 3 patents to his name, Sagara continues to push the boundaries of technology.
Latest Patents
One of his latest patents involves a wiring substrate that includes a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The substrate has an insulating surface, and the first conductive layer consists of a first part and a second part, with the second part being thinner than the first. This innovative design enhances the functionality of electronic devices. Another notable patent focuses on a wiring substrate that features a first wiring layer and a second wiring layer, which are interposed by an insulating film. This design includes a via conductor that connects the two layers, showcasing Sagara's expertise in creating efficient electronic components.
Career Highlights
Shuji Sagara is currently employed at Dai Nippon Printing Co., Ltd., where he applies his knowledge and skills to develop cutting-edge technologies. His work has garnered attention in the industry, and he is recognized for his innovative approaches to semiconductor design.
Collaborations
Sagara collaborates with talented individuals such as Masaya Tanaka and Ryohei Kasai, contributing to a dynamic work environment that fosters creativity and innovation.
Conclusion
Shuji Sagara's contributions to the field of wiring substrates and semiconductor devices highlight his role as a leading inventor in Japan. His innovative patents and collaborative efforts continue to shape the future of technology.