Dai Nippon Printing Co., Ltd.

Shuji Sagara

Masaya Tanaka

Yuichi Yamamoto

Ryohei Kasai

Tsuyoshi Tsunoda

Takamasa Takano

Yuki Aritsuka

Miyuki Suzuki

Yumi Yoshii

A wiring substrate of the present disclosure includes a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The substrate has an insulating surface. The first conductive layer is disposed on the substrate and includes a first part and a second part. The first part has a first thickness. The second part has a second thickness thinner than the first thickness and is adjacent to the first part. The first insulating layer is disposed on the first part and apart from the second part. The first insulating layer is disposed between the second conducting layer and the first part.

Wiring substrate and semiconductor device

Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Mounting component and electronic device

Mounting component, wiring substrate, electronic device and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Shuji Sagara