Suzhou, China

Shuilun Fu

This inventor holds 1 USPTO granted patent. Top assignee: Suzhou Metabrain Intelligent Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shuilun Fu. Retrieved from https://idiyas.com/inventor/shuilun-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Shuilun Fu: Inventor in Hard-Disk Expansion Technology

Introduction

Shuilun Fu is an inventor based in Suzhou, China, and is associated with Suzhou Metabrain Intelligent Technology Co., Ltd. His work includes an invention focused on configuring ports in hard-disk expansion equipment.

Latest Patents

Fu is credited with 1 patent: “Port Configuration Method, Component, and Hard Disk Expansion Apparatus.” The invention describes a method in which a back-panel controller uses stored port-configuration topology information to control the power cycle of an expanding chip. Once the chip is powered on, the controller sends a corresponding target signal. The chip then reads the matching port-configuration firmware image from internal memory and configures its ports accordingly. The approach is intended to make port configuration more efficient and potentially reduce hardware production and maintenance costs.

Career Highlights

Fu’s listed patent reflects work on hardware configuration and storage expansion systems. The disclosed method coordinates a controller, an expanding chip, and firmware images to configure the chip’s ports.

Collaborations

Fu’s listed coworkers include Quanquan Yu and Huanchao Wang. The patent information provided does not specify their individual contributions.

Conclusion

Shuilun Fu’s patent addresses a practical challenge in hard-disk expansion equipment by streamlining the configuration of an expanding chip’s ports.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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