Shui Cheung Woo

Title: Innovations by Shui Cheung Woo

Introduction

Shui Cheung Woo is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding apparatus technology. With a total of 2 patents, his work focuses on enhancing the efficiency and precision of bonding processes.

Latest Patents

One of his latest patents is titled "System for adjusting relative positions between components of a bonding apparatus." This invention includes a movable bond head collet, a reference marker that moves with the bond head collet, a flip head collet, first and second imaging devices, and an adjusting mechanism. The system captures images to align the bond head collet with the flip head collet, ensuring accurate placement of electrical components during bonding.

Another significant patent is the "Method and system for automatic bond arm alignment." This method involves rotating a bond arm around a longitudinal axis and determining its tilt angle relative to a bonding support surface. The goal is to align the bond arm perpendicularly to the bonding surface, enhancing the reliability of the bonding process.

Career Highlights

Shui Cheung Woo is currently employed at Asm Technology Singapore Pte Ltd. His work at this company has allowed him to develop innovative solutions that improve bonding technology. His expertise in this area has made him a valuable asset to his team.

Collaborations

Throughout his career, Shui has collaborated with talented individuals such as Liang Hong Tang and Wan Yin Yau. These collaborations have contributed to the advancement of bonding technologies and have fostered a creative environment for innovation.

Conclusion

Shui Cheung Woo's contributions to bonding apparatus technology through his patents demonstrate his commitment to innovation. His work continues to influence the industry and improve bonding processes.