Shuang Wu Huang

Title: Innovations by Shuang Wu Huang in Integrated Circuit Packaging

Introduction

Shuang Wu Huang is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit packaging. With three patents to his name, he has made significant advancements that improve the performance and efficiency of electronic devices.

Latest Patents

Huang's latest invention focuses on castellation wafer level packaging of integrated circuit chips. The systems and methods he developed enable the coupling of active circuit areas of chips to castellation blocks and, in some instances, input/output pads. These components are encapsulated and securely held in place by an encapsulant. During fabrication, the castellation blocks and input/output pads are sawed through, and if necessary, the wafer portion on which the devices are fabricated may be thinned. The resulting packages can function as leadless chip carrier packages or be stacked on one another. Importantly, when stacked, the respective contacts of the packages are coupled, allowing data to be written to and received from the packaged chips upon activation. This innovative approach significantly enhances the functionality and versatility of integrated circuit chips.

Career Highlights

Huang is currently employed at Micron Technology Incorporated, where he continues to work on cutting-edge solutions in semiconductor technology. His work not only showcases his technical expertise but also his commitment to advancing industry standards and practices.

Collaborations

Throughout his career, Huang has collaborated with talented professionals such as Suan Jeung Boon and Yong Poo Chia. These partnerships have allowed him to exchange ideas and foster innovation, contributing to a collaborative work environment that thrives on creativity and technical prowess.

Conclusion

Shuang Wu Huang's contributions to the field of integrated circuit packaging reflect his dedication to innovation and excellence in engineering. His patents, particularly in castellation wafer level packaging, not only enhance the functionality of electronic devices but also pave the way for future technological advancements. His ongoing work at Micron Technology Incorporated, combined with fruitful collaborations, suggests that Huang will continue to be a prominent figure in the realm of semiconductor technology.