Shu-yuan Ku

Title: Innovations of Shu-yuan Ku in Package Components

Introduction

Shu-yuan Ku is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of package components, particularly through his innovative patent. His work focuses on enhancing the functionality and efficiency of electronic packaging.

Latest Patents

Shu-yuan Ku holds a patent for a "Package component and forming method thereof." This invention includes a substrate and a conductive layer, where the substrate features a first surface. The conductive layer is positioned over the first surface and comprises a first conductive feature and a second conductive feature. Notably, the second conductive feature covers a portion of the first conductive feature, and its resistance is lower than that of the first conductive feature. This innovation aims to improve the performance of electronic devices.

Career Highlights

Shu-yuan Ku is associated with Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His role in this company has allowed him to contribute to cutting-edge technologies and advancements in electronic packaging.

Collaborations

Shu-yuan Ku has collaborated with talented individuals such as Chun-wei Chang and Jian-Hong Lin. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Shu-yuan Ku's contributions to the field of package components exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing electronic device performance through effective design and engineering.