Tianjin, China

Shu-Wei Zhang

This inventor holds 1 USPTO granted patent. Top assignee: Fulian Precision Electronics (Tianjin) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Wei Zhang. Retrieved from https://idiyas.com/inventor/shu-wei-zhang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Shu-Wei Zhang: Innovator in Heat Dissipation Technology

Introduction

Shu-Wei Zhang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of heat dissipation technology. His innovative approach has led to the development of a unique method for controlling heat dissipation fans.

Latest Patents

Shu-Wei Zhang holds a patent for a "Method for controlling heat dissipation fan and related apparatus." This invention provides a method and module for controlling a heat dissipation fan, which includes a Baseboard Management Controller (BMC) and a Complex Programmable Logic Device (CPLD). The method involves controlling the heat dissipation fan through the CPLD when the BMC is not in control. It also includes obtaining a predetermined rotational speed and control curve based on the BMC's status and detecting environmental temperature to adjust the fan's speed accordingly. He has 1 patent to his name.

Career Highlights

Shu-Wei Zhang is currently employed at Fulian Precision Electronics (Tianjin) Co., Ltd. His work at this company focuses on enhancing electronic components and systems, particularly in the area of thermal management.

Collaborations

Shu-Wei Zhang collaborates with his coworker, Nan Zhang, to further advance their projects and innovations in the field of electronics.

Conclusion

Shu-Wei Zhang's contributions to heat dissipation technology exemplify his innovative spirit and dedication to improving electronic systems. His patent reflects a significant advancement in managing thermal conditions in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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