Taiwan, China

Shu-Lung Chung

USPTO Granted Patents = 2 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Taoyuan County, TW (2013)
  • Taiwan, CN (2016)

Company Filing History:


Years Active: 2013-2016

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2 patents (USPTO):Explore Patents

Title: Innovation in Heat Dissipation: The Contributions of Shu-Lung Chung

Introduction: Shu-Lung Chung, a prominent inventor based in Taiwan, has made significant strides in the field of thermal management technology. With two patents to his name, he has developed innovative solutions aimed at enhancing the efficiency of heat dissipation in high-power electronic components.

Latest Patents: Chung's latest patents include a groundbreaking design for a finned heat dissipation module and a sintered heat pipe. The finned heat dissipation module is designed for cooling electronic components with a power output of 100 Watts or more. It features a heat exchange element with a sealed cavity that utilizes a powder sintering portion and a working liquid. This innovative design enables the effective transfer of heat from the electronic component to a heat sink, which dissipates the heat into the surrounding air through an advanced heat dissipation structure.

The second patent focuses on a sintered heat pipe and its manufacturing methods. This invention comprises a groove tube filled with a working fluid, incorporating a sintered powder layer on its inside walls. The unique design includes grooves that extend along the tube's axial direction, enhancing the heat transfer capabilities by ensuring effective fluid movement within the tube.

Career Highlights: Shu-Lung Chung is associated with Zhongshan Weiqiang Technology Co., Ltd., where he has contributed to the development of advanced heat management systems. His work has elevated the company's reputation within the electronics cooling sector, showcasing his commitment to innovation and excellence.

Collaborations: In his endeavors, Chung has collaborated with talented professionals such as Ke-chin Lee and Hung-Chieh Chen. Their collective expertise has fostered a dynamic development environment, driving forward-thinking innovations in thermal technologies.

Conclusion: Shu-Lung Chung's contributions and inventions in the field of heat dissipation demonstrate his significant role as an inventor within the technology sector. His patents not only address the critical challenges associated with heat management in high-power electronics but also pave the way for future advancements in thermal efficiency and design. Chung's dedication to innovation reflects the ongoing quest for improved solutions in electronics cooling, impacting industries that rely on high-performance components.

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