Taipei, Taiwan

Shu-Hsien Chung

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Acer Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Hsien Chung. Retrieved from https://idiyas.com/inventor/shu-hsien-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 80.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2019-2026

Loading Chart...
5 patents (USPTO):Explore Patents

Title: The Innovations of Shu-Hsien Chung

Introduction

Shu-Hsien Chung is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of packaging technology. With a total of 5 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

Among his latest patents are innovative designs such as a package cushioning member and a cushion structure for packing. These inventions demonstrate his commitment to enhancing the efficiency and effectiveness of packaging solutions.

Career Highlights

Shu-Hsien Chung is currently employed at Acer Inc., a leading technology company known for its innovative products. His role at Acer has allowed him to further develop his ideas and bring them to fruition in the marketplace.

Collaborations

Throughout his career, Shu-Hsien has collaborated with talented individuals such as Jhih-Hsien Wu and Chung-Hsien Lee. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.

Conclusion

Shu-Hsien Chung's contributions to packaging technology through his patents and collaborations highlight his innovative spirit and dedication to improving industry standards. His work continues to influence the field and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…