Shu Chia Hsu

Title: Innovations of Shu Chia Hsu

Introduction

Shu Chia Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, Hsu's work focuses on advanced manufacturing methods for semiconductor die packages.

Latest Patents

Hsu's latest patents include a semiconductor die package and method of manufacture. In this embodiment, an interposer features a first side with a first integrated circuit device attached using a first set of conductive connectors. Each connector in this set has a specific height. Additionally, a first die package is attached to the interposer with a second set of conductive connectors. This second set includes a first and a second conductive connector, each with different heights. A first dummy conductive connector is positioned between the interposer's first side and the die package. The design also incorporates an underfill beneath both the integrated circuit device and the die package, along with an encapsulant surrounding them.

Career Highlights

Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging.

Collaborations

Some of Hsu's coworkers include Kuan-Yu Huang and Sung-Hui Huang, who contribute to the innovative environment at their workplace.

Conclusion

Shu Chia Hsu's contributions to semiconductor technology through his patents reflect his expertise and dedication to innovation. His work continues to influence the industry and pave the way for future advancements.