This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Applied Materials, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Shreshtha Kumar Jaiswal
Introduction
Shreshtha Kumar Jaiswal is an accomplished inventor based in Kalispell, MT (US). He has made significant contributions to the field of hybrid bonding applications. His innovative approach has led to the development of a unique method that enhances the efficiency of bonding processes.
Latest Patents
Jaiswal holds a patent for an "Integrated process sequence for hybrid bonding applications." This method involves sequencing a hybrid bonding process by double linking a source of dies and a target. The process includes selecting a source of dies for bonding, choosing a target for the dies, and forming an integrated bonding product sequence. This sequence allows for optimized bonding process chamber allocations and timing, ultimately improving the bonding of dies from the source to the target.
Career Highlights
Shreshtha Kumar Jaiswal is currently employed at Applied Materials, Inc., where he continues to innovate in the field of hybrid bonding. His work has garnered attention for its potential to streamline manufacturing processes in the semiconductor industry.
Collaborations
Jaiswal collaborates with talented professionals such as Niranjan Pingle and Jitendra Ratilal Bhimjiyani. Their teamwork fosters an environment of creativity and innovation, leading to groundbreaking advancements in their field.
Conclusion
Shreshtha Kumar Jaiswal's contributions to hybrid bonding applications exemplify the spirit of innovation. His patent and ongoing work at Applied Materials, Inc. highlight his commitment to advancing technology in the semiconductor industry.