Company Filing History:
2 out of 42,508 
2 out of 182 
Years Active: 1992-1993
Title: Shouichi Irie: Innovator in Metal Bonding Techniques
Introduction
Shouichi Irie is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of metal bonding techniques, holding a total of 2 patents. His work focuses on enhancing the reliability of chip mount type packages and TAB packages while minimizing environmental impact.
Latest Patents
Irie's latest patents include a method of bonding metals and a method and apparatus for producing high-reliability chip mount type packages. These inventions utilize a technique that avoids the use of environmentally harmful flux. Specifically, his method involves irradiating bonding surfaces with an atomic or ion energy beam, allowing for the bonding of surfaces under normal atmospheric pressure in a continuous apparatus.
Career Highlights
Throughout his career, Shouichi Irie has worked with prominent companies such as Hitachi, Ltd. and Hitachi VLSI Engineering Corporation. His experience in these organizations has contributed to his expertise in the field of electronics and materials engineering.
Collaborations
Irie has collaborated with notable colleagues, including Takashi Nakao and Yoshiaki Emoto. These partnerships have likely enriched his research and development efforts in innovative bonding techniques.
Conclusion
Shouichi Irie stands out as an influential inventor in the realm of metal bonding technologies. His patents reflect a commitment to innovation and environmental responsibility, marking him as a key figure in advancing electronic packaging methods.